| Our PCB Technical Capabilities | ||
| No. | Item | Technical capabilities |
| 1 | Layers | 1-10 layers |
| 2 | Max. Board size | 2,000* 610 mm |
| 3 | Min. board Thickness | 2-layer 0.4mm |
| 4-layer 0.6mm | ||
| 6-layer 0.8mm | ||
| 8-layer 1.5mm | ||
| 10-layer 1.6~2.0mm | ||
| 4 | Min. line Width/Space | 0.1 mm (4mil) |
| 5 | Max. Copper thickness | 10.0 OZ |
| 6 | Min. S/M Pitch(solder mask) | 0.1 mm (4mil) |
| 7 | Min. hole size | 0.2 mm (8mil) |
| 8 | Hole dia. Tolerance (PTH) | ±0.05 mm (2mil) |
| 9 | Hole dia. Tolerance (NPTH) | '+0/-0.05 mm (2mil) |
| 10 | Hole position deviation | ±0.05 mm (2mil) |
| 11 | Outline tolerance | ±0.10 mm (4mil) |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | >1012 Ω Normal |
| 14 | Electric strength | >1.3KV /min |
| 15 | S/M abrasion | >6H |
| 16 | Thermal stress | 288 °C, 10 Sec |
| 17 | Test Voltage | 50-300 V |
| 18 | Min. blind/buried via | 0.2 mm (6mil) |
| 19 | Surface Finished | OSP, HAL, ENIG, ImAg, Imsn, Plating AG, Plating gold |
| 20 | Materials | CEM1, FR4, H-TG FR4, Aluminium, copper |
